導(dǎo)熱墊片典型材料

型號(hào)

結(jié)構(gòu)

厚度范圍

導(dǎo)熱系數(shù)

密度

介電常數(shù)@ 1 MHz

體積電阻率（ohm-cm）

Tflex 300

陶瓷填充硅膠片

0.50 -5.08 mm

1.2

1.8

4.5(@ 10 GHz)

1 x  10^13 

Tflex P100

Tgard 內(nèi)襯彈性體

0.50 - 5.08 mm

1.2

2.3

7.5

1.3 x 10^12 

Tflex HR400

陶瓷填充硅膠彈性體

 0.50- 10.16 mm

1.8

1.9

4.8

2 x 10^13 

Tflex HD300

陶瓷填充硅膠彈性體

 0.50 - 5.08 mm

2.7

3.1

6.6

1.2 x 10^14 

Tflex 600

氮化硼填充硅膠彈性體

 0.50- 5.08 mm

3

1.3

3.3 (@10 GHz)

2 x 10^13 

Tflex HR600

陶瓷填充硅膠片

0.25 - 5.08 mm

3

2.5

19

1 x 10^13 

Tflex HD400

陶瓷填充硅膠彈性體

0.50 -5.08 mm

4

3

10.7

2.7 x 10^14

Tflex HD700

陶瓷填充硅膠片

0.50 -5.08 mm

5

3.3

5

1.4 x 10^14

TflexHD80000

陶瓷填充硅膠片

1.0-5.0mm

6

3.3

9

1.0 x 10^16

Tflex SF800

陶瓷填充無(wú)硅填隙料

 0.50 - 4.06 mm

7.8

3.2

15.9

5x 10^12

液態(tài)間隙填材料

型號(hào)

結(jié)構(gòu)

導(dǎo)熱系數(shù)（W/m-K)(固化后）

密度

阻燃

介電擊穿電壓

介電常數(shù) @ 1MHz

Tflex CR350

兩部分陶瓷填充可分配硅膠填隙料

3.69

3.2

V-0

9KV AC

Tflex CR607

兩部分陶瓷填充可分配硅膠填隙料

6.4

3.43

V-0

6 kV AC

4.9

Tputty 403

單部分硅基可分配填隙料

2.3

2.48

V-0

>6KV AC

Tputty 508

陶瓷填充硅膠可分配填隙料

3.7

3.2

V-0

>3KV AC

Tputty 607

陶瓷填充硅膠可分配填隙料

6.4

3.45

V-0

>6KV AC (at 40 mil)

15

相變材料

型號(hào)

厚度范圍

導(dǎo)熱系數(shù)（W/m-K)

密度

介電常數(shù)@ 1 MHz

體積電阻率（ohm-cm）

相變軟化溫度 (?C)

Tpcm 200SP

3.2mm

1.5

Tpcm 580

0.076- 0.406 mm

3.8

2.87

3.0 x 10^12

50

Tpcm 580SP

4

45-60

Tpcm 7000

0.13- 0.64mm

7.5

2.5

31.54

5.4x10^15 Ω-cm

50-70

Tpcm 780

0.13mm- 0.64mm

5.4

2.5

22.9

1.5x10^13 Ω-cm

45-70

Tpcm 780SP

5.4

45 to 70

導(dǎo)熱油脂

型號(hào)

導(dǎo)熱系數(shù)（W/m-K)

密度

介電常數(shù)@ 1 MHz

體積電阻率

熱阻 (°C in
2/W)10 psi

粘合層厚度

Tgrease 1500

1.2

0.037

Tgrease 2500

3.8

5.6

3.5x10^12 

50μm

Tgrease 300X

3

2.69

25μm

Tgrease 880

3.1

2.73g/cc

9 x 10^13 

絕緣導(dǎo)熱材料

型號(hào)

厚度

伸長(zhǎng)率

拉伸強(qiáng)度

擊穿電壓（AC）

導(dǎo)熱系數(shù)W/mK

介電常數(shù) @ 1 MHz

Tgard 200

0.25mm

6000

5

3.32

Tgard 300

0.23 mm

5%

10 Mpa

6000

3.3

Tgard 500

0.23 mm

5%

11.7 Mpa

6000

3.3

備注：更詳細(xì)的產(chǎn)品應(yīng)用以及產(chǎn)品介紹

Typical Materials for thermally conductive gaskets

Model

Structure

Thickness range

Thermal conductivity（W/m-K)

Density

Dielectric constant @ 1 MHz

Volumetric resistivity （ohm-cm）

Tflex 300

Ceramic Filled Silicone Film

0.50 -5.08 mm

1.2

1.8

4.5(@ 10 GHz)

1 x  10^13 

Tflex P100

Tgard Lined Elastomers

0.50 - 5.08 mm

1.2

2.3

7.5

1.3 x 10^12 

Tflex HR400

Ceramic-filled silicone elastomer

 0.50- 10.16 mm

1.8

1.9

4.8

2 x 10^13 

Tflex HD300

Ceramic-filled silicone elastomer

 0.50 - 5.08 mm

2.7

3.1

6.6

1.2 x 10^14 

Tflex 600

Boron nitride filled silicone elastomers

 0.50- 5.08 mm

3

1.3

3.3 (@10 GHz)

2 x 10^13 

Tflex HR600

Ceramic Filled Silicone Film

0.25 - 5.08 mm

3

2.5

19

1 x 10^13 

Tflex HD400

Ceramic-filled silicone elastomer

0.50 -5.08 mm

4

3

10.7

2.7 x 10^14

Tflex HD700

Ceramic Filled Silicone Film

0.50 -5.08 mm

5

3.3

5

1.4 x 10^14

TflexHD80000

Ceramic Filled Silicone Film

1.0-5.0mm

6

3.3

9

1.0 x 10^16

Tflex SF800

Ceramic filled silicone-free gap filler

 0.50 - 4.06 mm

7.8

3.2

15.9

5x 10^12

Liquid gap filling material

Model

Structure

Thermal conductivity（W/m-K)

Density

Flame retardant

Dielectric Breakdown Voltage （2mm)

Dielectric constant @ 1MHz

Tflex CR350

Two part ceramic filled dispensable silicone gap filler

3.69

3.2

V-0

9KV AC

Tflex CR607

Two part ceramic filled dispensable silicone gap filler

6.4

3.43

V-0

6 kV AC

4.9

Tputty 403

Single part silica-based dispensable gap fillers

2.3

2.48

V-0

>6KV AC

Tputty 508

Ceramic filling silica gel dispensable gap filler

3.7

3.2

V-0

>3KV AC

Tputty 607

Ceramic filling silica gel dispensable gap filler

6.4

3.45

V-0

>6KV AC (at 40 mil)

15

Phase change materials

Model

Thickness range

Thermal conductivity （W/m-K)

Density

Dielectric constant @ 1 MHz

Volumetric resistivity（ohm-cm）

Phase change softening temperature (?C)

Tpcm 200SP

3.2mm

1.5

Tpcm 580

0.076- 0.406 mm

3.8

2.87

3.0 x 10^12

50

Tpcm 580SP

4

45-60

Tpcm 7000

0.13- 0.64mm

7.5

2.5

31.54

5.4x10^15 Ω-cm

50-70

Tpcm 780

0.13mm- 0.64mm

5.4

2.5

22.9

1.5x10^13 Ω-cm

45-70

Tpcm 780SP

5.4

45 to 70

Thermally conductive grease

Model

Thermal conductivity（W/m-K)

Density

Dielectric constant @ 1 MHz

Volumetric resistivity

Thermal resistance (°C in
2/W)10 psi

Thickness of adhesive layer

Tgrease 1500

1.2

0.037

Tgrease 2500

3.8

5.6

3.5x10^12 

50μm

Tgrease 300X

3

2.69

25μm

Tgrease 880

3.1

2.73g/cc

9 x 10^13 

Insulation and thermal conductivity materials

Model

Thickness

Elongation

Tensile strength

Breakdown voltage （AC）

Thermal conductivity W/mK

Dielectric constant  @ 1 MHz

Tgard 200

0.25mm

6000

5

3.32

Tgard 300

0.23 mm

5%

10 Mpa

6000

3.3

Tgard 500

0.23 mm

5%

11.7 Mpa

6000

3.3

Note: For more detailed product applications and product descriptions and related data, please check Laird's official website and refer to the information on the official website.