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產(chǎn)品詳細(xì)介紹
Product Details
有膠基材
Glued substrates
Pyralux? FR? 和Pyralux? LF?銅箔基板是在DuPont Kapton? PI薄膜的單面或雙面用一層專用阻燃型丙烯酸粘合劑粘結(jié)銅箔。
Pyralux? FR? and Pyralux? LF? copper foil substrates are copper foils bonded on one or both sides of DuPont Kapton? PI films with a special flame-retardant acrylic adhesive.
產(chǎn)品特點：
Product characteristics:
●可供應(yīng)多種厚度的PI或接著劑的銅箔基板。
●We can supply copper foil substrates with various thicknesses of PI or adhesives.
●優(yōu)良的耐熱、抗?jié)?div id="4qifd00" class="flower right">
●電氣特性佳，卓越的可撓性及尺寸穩(wěn)定性。
●Excellent electrical characteristics, excellent flexibility and dimensional stability.
無膠基材
Non-adhesive substrates
Pyralux?KP 為熱塑性聚酰亞胺膜與雙面銅箔壓合而成的雙面無膠覆銅板，捲狀材料, 100米/卷, 提供 250mm與500mm幅寬 ，主推型號KP122512E和KP182518E，材料亮點尺寸穩(wěn)定性好，主要應(yīng)用于LCM模組和攝像頭模組領(lǐng)域。
Pyralux?KP is a thermoplastic polyimide film and double-sided copper foil laminated into a double-sided adhesive-free copper laminate, rolled material, 100 meters/roll, available in 250mm and 500mm widths, the main model KP122512E and KP182518E, the material highlights good dimensional stability, mainly used in LCM modules and camera modules.
Pyralux? AK是以銅箔壓PI薄膜而成的雙面無膠基材，適用于高漲縮和高延展性要求的的軟板制作。
Pyralux? AK is a double-sided adhesive-free substrate made of copper foil with PI film, suitable for the production of flexible boards with high shrinkage and ductility requirements.
例如蘋果產(chǎn)品高數(shù)據(jù)傳輸技術(shù)中使用到的軟板，Pyralux? AK最符合軟板對于輕、薄、高密度布線的高品質(zhì)需求。
For example, Pyralux? AK best meets the high-quality requirements for light, thin and high-densityty cabling for soft boards used in the high data transfer technology of Apple products.
Pyralux? AC是以銅箔壓PI薄膜而成的單面無膠基材，適用于FPC多層板和軟硬結(jié)合板外層，產(chǎn)品結(jié)構(gòu)齊全，適用各種厚度軟板及軟硬板的Stack_up需求。
Pyralux? AC is a single-sided adhesive-free substrate made of copper foil with PI film, which is suitable for FPC multilayer boards and the outer layer of rigid-soft boards.
產(chǎn)品特點：
Product Features:
●極佳的尺寸穩(wěn)定性。
●Excellent dimensional stability.
●不易吸潮。
●Not easily absorbed by moisture
●銅-PI粘附強度高。
●High adhesion strength of copper-PI
●極佳的耐熱性。
●Excellent heat resistance
●高溫下抗老化時間長。
●Long anti-aging time at high temperature
●具耐熱/耐濕特性。
●Heat/moisture resistant
●低熱膨脹系數(shù)。
●Low coefficient of thermal expansion
高頻高速TA系列雙面無膠基材
High frequency and high-speed TA series double-sided adhesive-free substrate
高頻低損耗專用消費類電子雙面無膠基材
PI覆蓋膜
Pyralux? FR?和Pyralux? LF? 覆蓋膜是在DuPont Kapton? PI薄膜的單面，粘合上一層專用阻燃型丙烯酸系粘合劑。
產(chǎn)品特點：
●電氣特性佳。
●壓著時溢出量少。
●加工性良好。
●柔軟性優(yōu)。
杜邦粘結(jié)片（純膠）
Pyralux? FR?和Pyralux? LF?粘結(jié)片是一種專用阻燃型丙烯酸粘合劑。粘合劑基本上用來粘結(jié)柔性內(nèi)層板和剛性覆蓋層。也可在鋼板線路的制作過程中將柔性線路板粘結(jié)到剛性板上，及用于多層線路板的層間粘結(jié)。
產(chǎn)品特點：
●適宜多次壓著，特性不劣化。
●長期優(yōu)良的耐熱、抗?jié)瘛⑿刨囆浴?nbsp;
●電氣特性及可撓性佳。 ，DK3.2，DF 0.003，傳輸頻率可達(dá)10GHZ以下，2.5db/10cm@10GHZ,2mil微帶線設(shè)計，優(yōu)異的靜態(tài)折彎表現(xiàn)，2mil的線寬，彎折角度360°C， 死折半徑0mm，可以＞10次，電阻率變化小于10%。應(yīng)用在USB 3.0，無線充電線圈等高頻低損耗等領(lǐng)域。
High frequency low loss special consumer electronics double-sided adhesive-free substrate, DK3.2, DF 0.003, transmission frequency up to 10GHZ, 2.5db/10cm@10GHZ, 2mil microstrip line design, excellent static bending performance, 2mil line width, bending angle 360°C, dead bend radius 0mm, can be >10 times, resistivity change of less than 10%. Application in USB 3.0, wireless charging coils and other high frequency low loss and other fields.
PI Coverlay Film
Pyralux? FR? and Pyralux? LF? overlays are made by bonding a special flame-retardant acrylic adhesive to one side of a DuPont Kapton? PI film.
Pyralux? FR? 在線路板的制作中可作為軟板、剛性板的保護層，具有環(huán)保和阻焊絕緣的性能。
Pyralux? FR? is used as a protective layer for flexible and rigid boards in the fabrication of circuit boards with environmental and solder resist insulation properties. 
Product Features:
●Excellent electrical characteristics.
●Less spillage when pressed.
●Excellent processability.
●Excellent softness.
DuPont bonding sheet (pure adhesive)
Pyralux? FR? and Pyralux? LF? bonding sheets are specialized flame-retardant acrylic adhesives. The adhesives are basically used to bond flexible inner laminates to rigid overlays. They can also be used for bonding flexible boards to rigid boards during the fabrication of sheet metal circuits and for interlayer bonding of multilayer circuit boards.
Product Features
●Suitable for repeated pressing, no deterioration of characteristics.
●Excellent long-term heat resistance, humidity resistance, and reliability.
●Good electrical characteristics and flexibility.
