。根據(jù)了解到的信息，第二代杜邦濕法壓膜系統(tǒng)會大幅度的降低板面因灰塵、擦傷、凹凸不平等造成的開、短路。

The wet lamination technology originated from DuPont Group in the U.S. This technology was created to improve the yield of traditional printing fine lines open and short as well as improve production efficiency. After years of scientific research, DuPont finally developed dry films that can react well with water chemically, such as: SD200 series, ST900 series, FX900 series and other multi-purpose dry films.

DuPont wet lamination applications:

With the change of market environment, the application of DuPont wet lamination technology has also been widely promoted. At present, wet lamination technology is widely used in PCB, FPC, ITO (touch screen) and hardware etching, according to the statistics of DuPont China group of companies, there were 238 sets of equipment equipped with DuPont wet lamination system in 2010 and 374 sets at the end of 2012.

Advantages of DuPont wet lamination:

   1

、so that the rough copper surface to get a complete pressure film effect, significantly reduce the open, short circuit caused by bad

   2、Better bonding of copper surface to dry film

   3

、The production line is more delicate than dry pressing

Schematic diagram of the reaction between wet pressed dry film and water:

 
Figure 1: After the magnification of the pressed dry film, you can see that the original air inside the crater of the board surface has become water after the wet lamination.

Figure 2: After a period of resting, you can see that the dry film gradually reacts with water chemically and the dry film gradually penetrates into the pits.

Figure 3: After a long time of resting, it is found that the dry film has been fully integrated into the crater.

Note: After dipping the copper surface, it can accelerate the reaction with the dry film, drive away the gas from the rough places on the copper surface and make the dry film itself soften and stickier, and the bonding force with the copper surface is closer, and it can have a great filling effect on the pits and scratches on the copper surface.

The development of DuPont wet lamination:

As a leader in the dry film industry, DuPont China Group has been investing heavily in research and development of new products for many years. Regarding DuPont wet lamination, DuPont Group's Science and Technology Laboratory has started to develop the second generation of wet lamination system, which is currently in production testing at some customers. According to the information learned, the second generation of DuPont wet lamination system will significantly reduce the open and short circuit caused by dust, scuffing, unevenness, etc. on the board surface.